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TOSUN Completes A+ Round of Over 100 Million Yuan Financing, Led by SDIC

In October 2023, Shanghai TOSUN Technology Ltd. successfully completed over 100 million yuan A+ round of financing. This round of financing was led by the second phase of Advanced Manufacturing Industry Investment Fund managed by China Investment Merchants, and followed by the old shareholders of Fengnian Capital over investment.

This round of financing will be used for product development and globalized market expansion.

Founded in 2017, TOSUN has been focusing on the research and development of domestically independent and controllable automotive electronic basic toolchain products, and is also the domestic leading brand in this field. TOSUN's core software TSMaster and supporting hardware equipment, with embedded code generation, automotive bus analysis, simulation, testing and diagnostics, calibration and other core functions, covering the entire process of automotive OEMs and parts R & D, testing, production, testing, after-sales. There are more than 5,000 global enterprise users, covering: automobile OEMs, parts suppliers, chip manufacturers, equipment/service providers, engineering machinery, aerospace and other fields. Headquartered in the National University Science Park of Tongji University in Jiading District, Shanghai, the company also has branches in Guangzhou, Beijing, Changchun, Chengdu, Taiwan and Stuttgart.